23 results
A Detailed Study of Void Motion In Passivated Aluminum Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 563 / 1999
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- 10 February 2011, 103
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- 1999
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A Quantitative Study of Void Nucleation Times in Passivated Aluminum Interconnects
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- MRS Online Proceedings Library Archive / Volume 516 / January 1998
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- 10 February 2011, 83
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- January 1998
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The Effects of Passivation Thickness and Initial Aluminum Line Stress on Electromigration Behavior
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- MRS Online Proceedings Library Archive / Volume 516 / January 1998
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- 10 February 2011, 249
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- January 1998
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In-Situ Stress Measurements During Dry Oxidation of Silicon
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- MRS Online Proceedings Library Archive / Volume 473 / 1997
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- 10 February 2011, 95
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- 1997
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Observation of Electromigration Voiding in Cu Lines
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- MRS Online Proceedings Library Archive / Volume 473 / 1997
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- 10 February 2011, 235
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- 1997
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Stress and Microstructural Evolution of Lpcvd Polysilicon Thin Films During High Temperature Annealing
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- MRS Online Proceedings Library Archive / Volume 441 / 1996
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- 10 February 2011, 403
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- 1996
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In-situ Measurement of Viscous Flow of Thermal Silicon Dioxide Thin Films at High Temperature
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- MRS Online Proceedings Library Archive / Volume 446 / 1996
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- 10 February 2011, 261
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- 1996
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Measurement and interpretation of strain relaxation in passivated Al–0.5% Cu lines
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- Journal of Materials Research / Volume 11 / Issue 1 / January 1996
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- 31 January 2011, pp. 184-193
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- January 1996
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Mechanical Stress in VLSI Interconnections: Origins, Effects, Measurement, and Modeling
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- MRS Bulletin / Volume 20 / Issue 11 / November 1995
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- 29 November 2013, pp. 70-73
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- November 1995
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Quantitative Measurement of Interface Fracture Energy in Multi-Layer Thin Film Structures
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- MRS Online Proceedings Library Archive / Volume 391 / 1995
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- 15 February 2011, 91
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- 1995
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Measurement and Modeling of Intrinsic Stresses in CVD W Lines
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- MRS Online Proceedings Library Archive / Volume 391 / 1995
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- 15 February 2011, 115
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- 1995
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In Situ SEM Observations of Electromigration Voids in Al Lines under Passivation
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- Journal:
- MRS Bulletin / Volume 19 / Issue 6 / June 1994
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- 29 November 2013, pp. 51-55
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- June 1994
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The Effect of Intrinsic Passivation Stress on Stress in Encapsulated Interconnect Lines
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- MRS Online Proceedings Library Archive / Volume 356 / 1994
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- 21 February 2011, 465
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- 1994
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Stress-Induced Void Formation in Metal Lines
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- MRS Bulletin / Volume 18 / Issue 12 / December 1993
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- 29 November 2013, pp. 26-35
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- December 1993
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The Role of Indentation Depth on the Measured Hardness of Materials
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- MRS Online Proceedings Library Archive / Volume 308 / 1993
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- 15 February 2011, 613
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- 1993
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High Resolution Observation of Void Motion in Passivated Metal Lines Under Electromigration Stress
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- MRS Online Proceedings Library Archive / Volume 265 / 1992
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- 15 February 2011, 33
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- 1992
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Hardness and Modulus Studies on Dielectric Thin Films
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- MRS Online Proceedings Library Archive / Volume 265 / 1992
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- 15 February 2011, 219
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- 1992
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Understanding Void Phenomena in Metal Lines: Effects of Mechanical and Electromigration Stress
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- MRS Online Proceedings Library Archive / Volume 265 / 1992
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- 15 February 2011, 15
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- 1992
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Measurement and interpretation of stress in copper films as a function of thermal history
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- Journal of Materials Research / Volume 6 / Issue 7 / July 1991
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- 31 January 2011, pp. 1498-1501
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- July 1991
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Stresses in Passivated Films
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- MRS Online Proceedings Library Archive / Volume 188 / 1990
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- 16 February 2011, 3
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- 1990
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